V2F105C200Y1DDP [KYOCERA AVX]

TransFeed;
V2F105C200Y1DDP
型号: V2F105C200Y1DDP
厂家: KYOCERA AVX    KYOCERA AVX
描述:

TransFeed

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TransFeed  
AVX Multilayer Ceramic Transient Voltage Suppressors  
TVS Protection and EMI Attenuation in a Single Chip  
GENERAL DESCRIPTION  
AVX has combined the best electrical characteristics of its  
Schematic Diagram  
IN  
OUT  
TransGuard® Transient Voltage Suppressors (TVS) and its  
Feedthru Capacitors into a single chip for state-of-the-art  
overvoltage circuit protection and EMI reduction over a  
broad range of frequencies. This unique combination of  
multilayer ceramic construction in a feedthru configuration  
gives the circuit designer a single 0805 chip that responds  
to transient events faster than any TVS device on the mar-  
ket today, and provides significant EMI attenuation when in  
the off-state.  
Electrical Model  
IN  
OUT  
LS  
LS  
RP  
RV  
C
The reduction in parallel inductance, typical of the feedthru  
chip construction when compared to the construction of  
standard TVS or ceramic capacitor chips, gives the  
TransFeed product two very important electrical advan-  
tages: (1) faster “turn-on” time. Calculated response times  
of <200 pSec are not unusual with this device, and mea-  
sured response times range from 200 – 250 pSec. The  
TransFeed “turn-on” characteristic is less than half that of  
an equivalent TransGuard® part — and TransGuards® clamp  
transient voltages faster than any other bipolar TVS solution  
such as diodes; (2) the second electrical advantage of  
lower parallel inductance, coupled with optimal series  
inductance, is the enhanced attenuation characteristics of  
RON  
LP  
the TransFeed product. Not only is there significantly  
greater attenuation at a higher self-resonance frequency,  
but the roll-off characteristic becomes much flatter, result-  
ing in EMI filtering over a much broader frequency spec-  
trum. Typical applications include filtering/protection on  
Microcontroller I/O Lines, Interface I/O Lines, Power Line  
Conditioning and Power Regulation.  
GENERAL  
TYPICAL APPLICATIONS  
APPLICATIONS  
CHARACTERISTICS  
• Operating Teperature:  
-55°C to +125°C  
• Fingerprint ID Circuit  
• Magnetic Field Circuit  
• LCD Dashboard Driver  
• Bi-directional TVS  
• Narrow band, high attenuation filter  
• EMI Filtering over broader frequency  
range  
• Working Voltage: 5.6Vdc - 26 Vdc  
• Case Size: 0805  
Where designers are concerned with both  
transient voltage protection and EMI atten-  
uation, either due to the electrical perfor-  
mance of their circuits or due to required  
compliance to specific EMC regulations,  
the TransFeed product is an ideal choice.  
• Fastest Response Time to  
ESD Strikes  
• Energy Rating: 0.05 - 0.3J  
• Current: 20 - 120A  
• Max Feedthru Current: 0.5 - 1A  
080216  
83  
TransFeed  
AVX Multilayer Ceramic Transient Voltage Suppressors  
TVS Protection and EMI Attenuation in a Single Chip  
HOW TO ORDER  
V
2
F
1
05  
A
150  
Y
2
E
D
P
Varistor  
Feedthru  
Capacitor  
Voltage  
Varistor  
Clamping  
Voltage  
150 = 18V  
200 = 22V  
300 = 32V  
400 = 42V  
500 = 50V  
600 = 60V  
DC  
Packaging  
Code  
Resistance  
1 = 0.150 Ohms  
2 = 0.200 Ohms  
3 = 0.250 Ohms  
05 = 5.6VDC  
09 = 9.0VDC  
14 = 14.0VDC  
18 = 18.0VDC  
26 = 26.0VDC  
Pcs./Reel  
D = 1,000  
R = 4,000  
T = 10,000  
Chip Size  
2 = 0805  
No. of  
Energy  
Rating  
X = 0.05J  
A = 0.1J  
C = 0.3J  
Capacitance  
Tolerance  
Feedthru  
Current  
Termination Finish  
Elements  
P = Ni/Sn (Plated)  
Y = +100/-50ꢀ  
D = 500 mA  
E = 750 mA  
F = 1.0 Amp  
TRANSFEED ELECTRICAL SPECIFICATIONS  
AVX  
Part Number  
Working Working Breakdown Clamping Maximum Transient  
Peak  
Current  
Rating  
Typical  
Cap  
DC  
Resistance  
Maximum  
Feedthru  
Current  
Voltage Voltage  
Voltage  
Voltage  
Leakage  
Current  
Energy  
Rating  
(DC)  
(AC)  
V2F105A150Y2E _ _  
V2F105C150Y1F _ _  
V2F109A200Y2E _ _  
V2F109C200Y1F _ _  
V2F114A300Y2E _ _  
V2F114C300Y1F _ _  
V2F118A400Y2E _ _  
V2F118C400Y1F _ _  
V2F118X500Y3D _ _  
V2F126C600Y2E _ _  
5.6  
4.0  
8.5 20ꢀ  
8.5 20ꢀ  
18  
18  
22  
22  
32  
32  
42  
42  
50  
60  
35  
35  
25  
25  
15  
15  
10  
10  
10  
10  
0.10  
0.30  
0.10  
0.30  
0.10  
0.30  
0.10  
0.30  
0.05  
0.3  
30  
120  
30  
800  
2500  
575  
1800  
300  
900  
200  
500  
75  
0.200  
0.150  
0.200  
0.150  
0.200  
0.150  
0.200  
0.150  
0.250  
0.2  
0.75  
1.00  
0.75  
1.00  
0.75  
1.00  
0.75  
1.00  
0.50  
0.75  
5.6  
4.0  
9.0  
6.4  
12.7 15ꢀ  
12.7 15ꢀ  
18.5 12ꢀ  
18.5 12ꢀ  
25.5 10ꢀ  
25.5 10ꢀ  
25.5 10ꢀ  
34.5 10ꢀ  
9.0  
6.4  
120  
30  
14.0  
14.0  
18.0  
18.0  
18.0  
26.0  
10.0  
10.0  
13.0  
13.0  
13.0  
18.0  
120  
30  
120  
20  
80  
250  
Termination Finish Code  
Packaging Code  
VW (DC) DC Working Voltage (V)  
VW (AC) AC Working Voltage (V)  
ET  
IP  
Cap  
DCR  
IFT  
Transient Energy Rating (J, 10x1000μS)  
Peak Current Rating (A, 8x20μS)  
Typical Capacitance (pF) @ 1MHz and 0.5 V  
DC Resistance (Ohms)  
VB  
VB Tol  
VC  
Typical Breakdown Voltage (V @ 1mADC)  
VB Tolerance is from Typical Value  
Clamping Voltage (V @ 1A 8x20μS)  
Maximum Leakage Current at the Working  
Voltage (μA)  
Maximum Feedthru Current (A)  
IL  
080216  
84  
TransFeed  
AVX Multilayer Ceramic Transient Voltage Suppressors  
TVS Protection and EMI Attenuation in a Single Chip  
dB Attenuation vs Frequency  
0
-10  
-20  
-30  
-40  
-50  
0
-10  
-20  
-30  
-40  
-50  
TransFeed 0.1J  
TransFeed 0.3J  
18LC  
18A  
18C  
14C  
14A  
9A  
9C  
5C  
5A  
-60  
-70  
-60  
-70  
0.01  
0.1  
1
10  
0.01  
0.1  
1
10  
Frequency (GHz)  
Frequency (GHz)  
DIMENSIONS  
mm (inches)  
S
L
W
T
BW  
BL  
EW  
X
2.01 0.20  
1.25 0.20  
1.143 Max.  
0.46 0.10  
0.18 + 0.25 -0.08  
0.25 0.13  
1.02 0.10  
0.23 0.05  
0805  
(0.079 0.008) (0.049 0.008) (0.045 Max.) (0.018 0.004) (0.007 + 0.010 -0.003) (0.010 0.005) (0.040 0.004) (0.009 0.002)  
RECOMMENDED SOLDER PAD LAYOUT (Typical Dimensions)  
mm (inches)  
C
T
P
S
W
L
0805  
3.45 (0.136)  
0.51 (0.020)  
0.76 (0.030)  
1.27 (0.050)  
1.02 (0.040)  
0.46 (0.018)  
4 Pad Layout  
L
T
X
S
P
T
P
BW  
W
S
C
L
INPUT  
OUTPUT  
BL  
W
C
L
EW  
080216  
85  
TransFeed  
AVX Multilayer Ceramic Transient Voltage Suppressors  
TVS Protection and EMI Attenuation in a Single Chip  
PERFORMANCE CHARACTERISTICS  
INSERTION LOSS COMPARISON  
®
(TransFeed vs TransGuard )  
0805 – dB vs Frequency  
5.6V, 0.1J  
VC080505A150  
14V, 0.1J  
VC080514A300  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
0
-10  
-20  
-30  
-40  
-50  
-60  
V2F105A150Y2E  
V2F114A300Y2E  
0.01  
0.1  
Frequency (GHz)  
1
10  
0.01  
0.1  
Frequency (GHz)  
1
10  
18V, 0.1J  
VC080518A400  
18V, 0.05J  
VC08LC18A500  
0
-10  
-20  
-30  
-40  
-50  
-60  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
V2F118X500Y3D  
V2F118A400Y2E  
0.01  
0.1  
Frequency (GHz)  
1
10  
0.01  
0.1  
1
10  
Frequency (GHz)  
5.6V, 0.3J  
14V, 0.3J  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
VC080514C300  
VC080505C150  
V2F105C150Y1F  
V2F114C300Y1F  
0.01  
0.1  
Frequency (GHz)  
1
10  
0.01  
0.1  
Frequency (GHz)  
1
10  
18V, 0.3J  
0
-10  
-20  
-30  
-40  
-50  
-60  
-70  
VC080518C400  
V2F118C400Y1F  
0.01  
0.1  
Frequency (GHz)  
1
10  
080216  
86  
TransFeed  
AVX Multilayer Ceramic Transient Voltage Suppressors  
TVS Protection and EMI Attenuation in a Single Chip  
PERFORMANCE CHARACTERISTICS  
CURRENT vs TEMPERATURE  
0805 – 0.1 Joule  
30  
Note:  
Dashed  
18V  
14V  
Portions  
Not Guaranteed  
18LC  
25  
20  
5V  
9V  
0.3  
0.5  
0.75  
1
Current (Amps)  
CURRENT vs TEMPERATURE  
0805 – 0.3 Joule  
30  
18V  
25  
20  
14V  
5V  
0
0.25  
0.5  
0.75  
1
Current (Amps)  
080216  
87  
TransFeed  
AVX Multilayer Ceramic Transient Voltage Suppressors  
TVS Protection and EMI Attenuation in a Single Chip  
PERFORMANCE CHARACTERISTICS  
FEEDTHRU VARISTORS  
AVX Multilayer Feedthru Varistors (MLVF) are an ideal choice The electrical model for a ZnO MLV and a ZnO Feedthru MLV  
for system designers with transient strike and broadband are shown below. The key difference in the model for  
EMI/RFI concerns.  
the Feedthru is a transformation in parallel to series induc-  
tance. The added series inductance helps lower the injected  
transient peak current (by 2πfL) resulting in an additional ben-  
efit of a lower clamping voltage. The lowered parallel induc-  
tance decreases the turn on time for the varistor to <250ps.  
Feedthru Varistors utilize a ZnO varistor material and the  
electrode pattern of a feedthru capacitor. This combination  
allows the package advantage of the feedthru and material  
advantages of the ZnO dielectric to be optimized.  
ZnO MLV Feedthrus exhibit electrical and physical advantages  
over standard ZnO MLVs. Among them are:  
1. Faster Turn on Time  
2. Broadband EMI attenuation  
3. Small size (relative to discrete MLV and EMI filter schemes)  
Discrete MLV Model  
Discrete MLVF Model  
To Device  
Requiring  
Protection  
To Device  
Requiring  
Protection  
PCB  
Trace  
LS  
LS  
Solder Pad  
Solder Pad  
LP  
C
RP  
RV  
C
RV  
RP  
R
on  
LP  
Solder Pad  
R
on  
Solder Pad  
Where: R  
R
=
Voltage Variable resistance  
(per VI curve)  
Where: R  
=
=
Voltage Variable resistance  
(per VI curve)  
v
v
1012  
Ω
R
Body IR  
p
p
C
R
=
=
=
defined by voltage rating and energy level  
turn on resistance  
parallel body inductance  
C
R
=
=
=
=
defined by voltage rating and energy level  
turn on resistance  
minimized parallel body inductance  
series body inductance  
on  
on  
L
L
L
p
p
s
080216  
88  
TransFeed  
AVX Multilayer Ceramic Transient Voltage Suppressors  
TVS Protection and EMI Attenuation in a Single Chip  
PERFORMANCE CHARACTERISTICS  
APPLICATIONS  
MARKET SEGMENTS  
TYPICAL CIRCUITS REQUIRING  
TRANSIENT VOLTAGE  
PROTECTION AND EMI FILTERING  
• EMI Suppression  
• Broadband I/O Filtering  
• Vcc Line Conditioning  
• Computers  
• Automotive  
• Power Supplies  
• Multimedia Add-On Cards  
• Bar Code Scanners  
• Remote Terminals  
• Medical Instrumentation  
Test Equipment  
Transceivers  
• Cellular Phones / Pagers  
The following applications and schematic diagrams  
show where TransFeed TVS/ EMI filtering devices might  
be used:  
FEATURES  
• Small Size  
• Low ESR  
• Ultra-fast Response Time  
• Broad S21 Characteristics  
• System Board Level Interfaces: (Fig. 1)  
Digital to RF  
Analog to Digital  
Digital to Analog  
• Voltage Regulation (Fig. 2)  
• Power Conversion Circuits (Fig. 3)  
• GaAs FET Protection (Fig. 4)  
Fig. 1 – System Interface  
Fig. 2 – Voltage Regulators  
REGULATOR  
+
Sensor/Keyboard/  
Touchscreen Input  
DIGITAL  
BOARD  
RF BOARD  
By X Bus  
Fig. 3 – Power Conversion Circuits/Power Switching Circuits  
+3.3V  
MAIN  
POWER  
POWER  
MANAGEMENT  
CHIP  
INTERFACE  
CARD  
+3.3V  
+1.8V  
Sensor Input  
Display  
ANALOG  
BOARD  
DIGITAL  
BOARD  
+5V  
+12V  
Keyboard  
ASIC  
DIGITAL  
BOARD  
ANALOG  
BOARD  
Fig. 4 – GaAs FET Protection  
OUTPUT  
INPUT  
SPECIFICATION COMPARISON  
MLVF  
0805  
PARAMETER  
MLV  
0805  
5ph  
L
L
typical  
typical  
typical  
typical  
typical  
typical  
N/A  
s
<600nh  
<1.5nh  
p
<0.025Ω  
R
C
R
R
<0.1Ω  
on  
100pf to 2.5nf  
see VI curves  
>0.25 x 1012  
100pf to 5.5nf  
see VI curves  
>1 x 1012  
v
Ω
Ω
p
<250ps  
Typical turn on time  
Typical frequency response  
<500ps  
A comparison table showing typical element parameters and resulting  
performance features for MLV and MLVF is shown above.  
080216  
89  

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